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<title>New NASA STI</title>
<link>http://www.sti.nasa.gov/scan/scan.html</link>
<description>
<![CDATA[
<p><b>Today's Listing of New NASA STI in the NASA Aeronautics and Space Database.</b></p>]]>
</description>
<language>en-us</language>
<lastBuildDate>Mon, 23 Nov 2009 10:00:00 EST</lastBuildDate>

<image>
<title>NASA Insignia</title>
<url>http://www.sti.nasa.gov/3Dmeatball.jpg</url>
<link>http://www.sti.nasa.gov</link>
</image>

<item>
<title>On Nibbles and Bytes: The Conundrum of Memory for Space Systems - NASA Electronic Parts and Packaging (NEPP) and Efforts in Memories</title>
<link>http://www.sti.nasa.gov/scan/rss99-01.html#1123001</link>
<description>
<![CDATA[Abstract: Radiation requirements and trends. TID: 1) >90% of NASA applications are < 100 krads-Si in piecepart requirements. a) Many commercial devices (NVM and SDRAMs) meet or come close to this. b) Charge pump TID tolerance has improved an order magnitude over the last 10 years. 2) There are always a few programs with higher level needs and, of course, defense needs SEL: 1) Prefer none or rates that are considered low risk. a) Latent damage is a bear to deal with. 2) As we re packing cells tighter and even with lower Vdd, we re seeing SEL on commercial devices regularly (<90nm). a) Often in power conversion, I/O, or control areas. SEU: 1) It s not the bit errors, it s the SEFIs errors that are the biggest issues. a) Scrubbing concerns for risk, power, speed....]]>
</description>
<pubDate>Mon, 23 Nov 2009 10:00:00 EST</pubDate>
</item>

<item>
<title>The Fiber Optic Subsystem Components on Express Logistics Carrier for International Space Station</title>
<link>http://www.sti.nasa.gov/scan/rss99-01.html#1123002</link>
<description>
<![CDATA[Abstract: ISS SSP 50184 HRDL optical fiber communication subsystem, has system level requirements that were changed to accommodate large loss optical fiber links previously installed. SSQ22680 design is difficult to implement, no metal shell over socket/pin combination to protect the weak part of the pin. Additions to ISS are planned for the future....]]>
</description>
<pubDate>Mon, 23 Nov 2009 10:00:00 EST</pubDate>
</item>

<item>
<title>Space Environmental Effects on Materials and Processes</title>
<link>http://www.sti.nasa.gov/scan/rss99-01.html#1123003</link>
<description>
<![CDATA[Abstract: The Materials and Processes (M&P) Branch of the Structural Engineering Division at Johnson Space Center (JSC) seeks to uphold the production of dependable space hardware through materials research, which fits into NASA's purpose of advancing human exploration, use, and development of space. The Space Environmental Effects projects fully support these Agency goals. Two tasks were assigned to support M&P. Both assignments were to further the research of material behavior outside of Earth's atmosphere in order to determine which materials are most durable and safe to use in space for mitigating risks....]]>
</description>
<pubDate>Mon, 23 Nov 2009 10:00:00 EST</pubDate>
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